Using Digital Imaging Correlation (DIC) we provide real time stress analysis of loaded elements, either within the laboratory environment or on-site.

We are able to trace the load distribution within a product or building by using the technique to produce a visual image of performance, thus enabling any areas of weakness or possible future problems to be predicted.

Our experts also use the stress strain data produced to guide you with your product development; this data can also be used in Finite Element Analysis (FEA) to support the models developed.  Our analysis can also show whether materials have been over-engineered. This information could help you to save costs, for example by trimming down material thickness or by specifying components with lower performance thresholds.